Thermal resistance analysis software
Product Introduction
This software is mainly used for analyzing the thermal impedance characteristics of multi-layer structures in power semiconductor modules. Based on the dynamic temperature information obtained from the temperature measurement platform of power semiconductor devices, the thermal resistance and heat capacity parameters of power semiconductors are accurately calculated to evaluate their heat dissipation performance.
Function
Static thermal resistance analysis
Analysis of Thermal Resistance Information of Power Modules
Dynamic impedance analysis
Analysis of Dynamic Impedance Curve of Power Module
Multilayer impedance analysis
Analysis of multi-layer impedance structure function
Product Features
Feature 1
Device to system level testing
Monitoring of Power Semiconductor Devices from Device to Converter Level
Feature 2
Industrial installation testing
Plug and play, no need for external power supply
Feature 3
Risk reduction
Non invasive, no need to connect to the internal system under test
Product specification sheet
